Produits > CPU Coolers > ETD-T60 [EOL]
ETS-T50A-BVT
ETS-N30II
ETS-T40F-BK
ETS-T40F-RF
ETS-T40F-TB
LIQMAX II 240
LIQMAX II 120S
LIQTECH 120X
LIQTECH 240
ETS-T40-W [EOL]
ETS-T40-BK [EOL]
ETS-T40 [EOL]
ELC120-TA [EOL]
ETS-N30 [EOL]
ELC120-TB [EOL]
LIQMAX 120S [EOL]
ELC240 [EOL]
ETD-T60 [EOL]
 
 
CPU COOLERS ETD-T60 [EOL]

 

CARACTERISTIQUES

 

  • Leading thermal resistance performance 0.12 °C/W.
    • Patented VGF (Vortex Generator Flow) technology to greatly increase air convection.
    • Unique air path creating high VEF (Vacuum Effect Flow) to optimize the airflow.
    • Each heat pipes soldered to the fins and bases for a definite contact in producing high efficiency rate of heat transfer.
  • Down flow design to cool CPU and its surrounding devices such as MOSFET and North bridged chipset.
  • Six Ø6mm heat pipes crossed from two sides of the heat sink to greatly improve cooling performance.
  • Nickel-plated heat pipes to reduce oxidation effect and maintain the top performance for long-term usage.
  • Patented universal brackets.
    • Support Intel® LGA 775/1155/1156/1366, AMD® AM2/AM2+/AM3/ AM3+/FM1.
    • Apply AAP (Auto-Adjustable-Pressure) design giving perfect contact force (18~28kgw) between CPU and cooler.
  • Patented circular LED lights and fancy fan cover for the utmost eye-catching (ETD-T60-VD only).
  • Unique T.B.Silence/T.B.Vegas Duo with PWM fan to adjust the power efficiently.
  • Anti-vibration rubbers prevent fan vibration and absorb noise.
  • High thermal conductivity grease to ensure the best thermal conduction between CPU and the heat sink.

 

High thermal conductivity

 

 

SPECIFICATIONS

 


 

Material Copper heat pipes, aluminum fins
Overall Dimension 151(L) x 137(W) x 112(H) mm (ETD-T60-TB) / 151(L) x 131(W) x 115(H) mm (ETD-T60-VD)
Heat Sink Dimension 151(L) x 125(W) x 85(H) mm
Weight 540 g
Heat Pipe 6 x Ø6 mm
Thermal Resistance 0.12°C/W
Thermal Grease Dow Corning® TC-5121
Compatible Socket Intel® LGA 775/1150/1155/1156/1366/2011, AMD® AM2/AM2+/AM3/AM3+/FM1

 

 

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