Produits > CPU Coolers > ETS-T40 [EOL]




  • World leading thermal resistance performance of 0.09°C/W.
    • Patented VGF (Vortex generator flow) technology to greatly increase air convection.
    • Patented SEF (Stack Effect) design to enhance heat transfer.
    • Unique air path creating high VEF (Vacuum Effect) to optimize the airflow.
    • Patented HDT (Heat Pipe Direct Touch) Technology to ensure rapid thermal conduction and eliminate CPU hotspot.
  • Side flow type with four Ø6mm high performance heat pipes.
  • Unique T.B.Silence PWM fan to adjust the power efficiently and keep the silence. (ETS-T40-TB only)
  • Patented circular type LED fan for the utmost eye-catching. (ETS-T40-TA & ETS-T40-VD only)
  • Nickel-plated heat sink to reduce oxidation effect and maintain the top performance. (ETS-T40-TA only)
  • Dual fan installed option and solid springs attached.
  • Anti-vibration rubbers prevent fan vibration and absorb noise.
  • Univeral bracket for Intel® 775/1150/1155/1156/1366/2011 and AMD® AM2/AM2+/AM3/AM3+/FM1.
  • High thermal conductivity grease to ensure the best thermal conduction between CPU and the heat sink.


X-Socket compatible

High thermal conductivity






Material Copper heat pipes, aluminum fins
Overall Dimension 139(L) x 93(W) x 160(H) mm
Heat Sink Dimension 139(L) x 70(W) x 160(H) mm
Weight 610 g
Heat Pipe 4 x Ø6 mm
Thermal Resistance 0.09°C/W
Thermal Grease Dow Corning® TC-5121
Compatible Socket Intel® LGA 775/1150/1155/1156/1366/2011, AMD® AM2/AM2+/AM3/AM3+/FM1





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