Produits > Coolers > ETS-T40
 
 
COOLERS ETS-T40

CARACTERISTIQUES

 

World leading thermal resistance performance of 0.09°C/W.
- Patented VGF (Vortex generator flow) technology to greatly increase air convection.
- Patented SEF (Stack Effect) design to enhance heat transfer.
- Unique air path creating high VEF (Vacuum Effect) to optimize the airflow.
- Patented HDT (Heat Pipe Direct Touch) Technology to ensure rapid thermal conduction and eliminate CPU hotspot.

 
Side flow type with four Ø6mm high performance heat pipes.
 
Unique T.B.Silence PWM fan to adjust the power efficiently and keep the silence. (ETS-T40-TB only)
 
Patented circular type LED fan for the utmost eye-catching. (ETS-T40-TA & ETS-T40-VD only)
 
Nickel-plated heat sink to reduce oxidation effect and maintain the top performance. (ETS-T40-TA only)
 
Dual fan installed option and solid springs attached.
 
Anti-vibration rubbers prevent fan vibration and absorb noise.
 
Universal bracket for Intel® 775/1155/1156/1366/2011 and AMD® AM2/AM2+/AM3/AM3+/FM1.
 

High thermal conductivity grease to ensure the best thermal conduction between CPU and the heat sink.

 

 


 

SPECIFICATIONS

 
 Compatible Socket  Intel® LGA 775/1155/1156/1366/2011, AMD® AM2/AM2+/AM3/AM3+/FM1
 Overall Dimension  139(L) x 93(W) x 160(H) mm
 Heat Sink Dimension  139(L) x 70(W) x 160(H) mm
 Weight  610 g
 Heat Pipe  4 x Ø6 mm
 Material  Copper heat pipes, aluminum fins
 Thermal Resistance  0.09°C/W
 Thermal Grease  Dow Corning® TC-5121

 

FICHE PRODUIT

 
 
FICHE D´UTILISATION
 



Mentions légales | © 2012 Enermax |